Semiconductor
Wafer Test
The Wafer Test is used to test the electrical performance and functionality of semiconductor products.
Probe Card
MLO Flip Chip &
MLC Flip Chip
MLO(Multi-Layer Organic) Flip Chip & MLC(Multi-Layer Ceramic) Flip Chip technology are used to enhance the performance on various advanced electronics applications.
Techwell is the only one that presents a leading-edge technology in Flip Chip Bonding.
Package Test
The Package Test, as part of the back-end semiconductor manufacturing process, involves conducting tests to evaluate the performance and reliability of packaged semiconductor products.
Load Board
Burn-in Board
LED Display
LED Display Board
LED displays produced by Techwell are being used on bus stops and building exteriors, with LEDs mounted on transparent glass.
5G
5G Antenna Board
Our specialized 5G Antenna board improves 5G wireless communication and connectivity.
Techwell had initiated the mass production of Antenna boards for 5G and we are currently conducting continuous research and development.
